Praktische Beispiele aus dem industriellen Einsatz
L-LAS-LT-110-HD2
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晶圆边缘检测 应可靠地检测出80 微米厚的晶片的边缘。 Wafer edge detection The edges of wafers with a thickness of 80µm should be detected. |
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测量一个冲压弯件和一个旋转件之间的高度差 应直接在焊接过程开始前检查一个冲压弯件和一个发光的旋转件之间的高度差。 Vertical height control between a turned metal part and a press-bent part The vertical height between a shiny turned metal part and a press-bent part should be measured immediately before welding. |
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在黑色橡胶缓冲件上测量距离 应测量与黑色橡胶表面的距离。 Distance control of black rubber buffers The distance of black rubber buffers should be controlled. |
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检查钢制旋转件的内齿 应在一个带有内齿的旋转件旋转期间监测齿长和齿与齿的间隙之比例。 Quality control of internal gears The width of the teeth as well as the gap between the teeth of internal gears should be controlled. |
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给上漆金属板定位 应以很高的精度测定上漆板材的距离和棱边。在此应注意，必须覆盖住一个较高的从黑亮表面一直延伸到白色哑光表面的动态范围。此外，还应兼顾整个色系。 Position detection of lacquered metal sheets The edge of different lacquered metal sheets should be precisely detected. Furthermore the distance of the painted metal plates should be measured. At this, it has to be taken into account, that a color gamut as well as gray scale range from shiny black to matt white should be covered. |
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